MOBILE WORLD 1Pcs Stencil Universal 0.3/0.35/0.4/0.5mm BGA Reballing Stencil Solder Net for All smartphone’s cpu

Price: ₹1,299 - ₹449.00
(as of Nov 19, 2025 01:38:49 UTC – Details)



These stencils can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC. Solve the trouble when computer maintenance engineers in the use of direct heating steel mesh. Durable in use. High success rate of planting tin, the solder balls can be formed once when you are proficient. Simple and convenient to use.
Item Type: BGA Reballing Stencil Colour: silver Material: stainless steel
Only the above package content, other products are not included. Note: Light shooting and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.
Package Include: 1Pcs BGA Stencil